1 surmount tm pin diodes ma4sps421, ma4sps422 rev. v7 ma4sps42x series ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. features ?? surface mount ?? no wire bonding required ?? rugged silicon-glass construction ?? silicon nitride passivation ?? polymer scratch protection ?? low parasitic capacitance and inductance ?? higher average and peak power handling ?? rohs compliant* and 260o reflow compatible description this device is a silicon-glass pin diode chip fabricated with m/a-com technology solutions patented hmic tm process. this device features two silicon pedestals embedded in a low loss, low dis- persion glass. the diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by ma king the pedestal side- walls electrically conductive. selective backside metallization is applied producing a surface mount device. this vertical topology provides for exceptional heat transfer. the topside is fully encapsulated with silicon nitri de and has an additional polymer layer for scratch and impact protection. these protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. applications these surmount devices are suitable for usage in moderate incident power (10w c.w.) or higher incident peak power (500w) series, shunt, or series-shunt switches. lower parasitic inductance, 0.1 to 0.2nh, and excellent rc constant (0.45ps), make the devices ideal for higher frequency switch elements compared to their plastic device counterparts. inches mm min. max. min. max. a 0.040 0.042 1.025 1.075 b 0.021 0.023 0.525 0.575 c 0.004 0.008 0.102 0.203 d 0.013 0.015 0.325 0.375 e 0.011 0.013 0.275 0.325 f 0.013 0.015 0.325 0.375 g 0.019 0.021 0.475 0.525 dim parameter absolute maximum forward current 250ma reverse voltage -200v operating temperature -55c to +125c storage temperature -55c to +150c junction temperature +175c dissipated power ( rf & dc ) 1.8w mounting temperature +280c for 30 seconds absolute maximum ratings @ t a = 25c (unless otherwise specified) ma4sps421 ma4sps422 1. backside metal: 0.1 m thick. 2. yellow hatched areas indicate backside ohmic gold contacts. 3. all devices have the same outline dimensions (a to g). * restrictions on hazardous substanc es, european union directive 2002/95/ec.
2 surmount tm pin diodes ma4sps421, ma4sps422 rev. v7 ma4sps42x series ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. electrical specifications @ t a = +25c 1. total capacitance, c t , is equivalent to the sum of junction capacitance and parasitic capacitance. c t = c j (junction capacitance) + c par (parasitic capacitance) 2. series resistance r s is equivalent to the total diode resistance: r s = r j (junction capacitance junction resistance) + r o (ohmic resistance) 3 r s and c t are measured on an hp4291a impedance analyzer with die mounted in an ods-186 package. . 4. steady-state r ?jl measured with die mounted in an ods-186 package. parameter symbol conditions units ma4sps421 ma4sps422 typ. max. typ. max. capacitance c t 0v, 1mhz 1 pf 0.130 0.175 0.340 0.500 capacitance c t 0v, 1ghz 1,3 pf 0.080 0.140 capacitance c t - 40v, 1mhz 1 pf 0.090 0.125 0.180 0.300 capacitance c t - 40v, 1ghz 1,3 pf 0.070 0.130 resistance r s +10ma, 1ghz 2,3 ? 6.200 3.100 forward voltage v f +10ma v 0.900 0.950 0.840 0.900 reverse leakage current i r -200v a |-10| |-10| input third order intercept point ii p 3 f 1 = 1000mhz dbm 50 50 f 2 = 1010mhz input power = +10dbm i bias = +10ma minority carrier lifetime t l +10ma / -6ma s 5 10 (50% - 90% v) c.w. thermal resistance r ?jl i h = 0.5a, i l = 10ma 4 c/w 80 70
3 surmount tm pin diodes ma4sps421, ma4sps422 rev. v7 ma4sps42x series ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. typical performance @ t amb = +25c rp vs voltage (@ 100mhz & 1ghz) ma4sps421 1 10 100 1000 10000 100000 1000000 0 10203040 voltage (v) rp (ohms) 1ghz 100mhz rp vs voltage (@ 100mhz & 1ghz) ma4sps422 1 10 100 1000 10000 100000 1000000 0 10203040 voltage (v) rp (ohms) 1ghz 100mhz rs vs. current @ 100mhz & ghz ma4sps422 ct vs voltage (@ 100mhz & 1ghz) ma4sps421 0.0e+00 5.0e-14 1.0e-13 1.5e-13 2.0e-13 2.5e-13 3.0e-13 0 10203040 voltage (v) ct (f) 100mhz 1ghz ct vs voltage (@ 100mhz & 1ghz) ma4sps422 0.0e+00 5.0e-14 1.0e-13 1.5e-13 2.0e-13 2.5e-13 3.0e-13 0 10203040 voltage (v) ct (f) 100mhz 1ghz 1.00 10.00 100.00 1.00e-03 1.00e-02 1.00e-01 100mhz 1ghz rs vs. current (100mhz & 1ghz) ma4sps421 1.00 10.00 100.00 1.00e-03 1.00e-02 1.00e-01 cur r ent ( a ) rs (ohms) 100mhz 1 ghz rs vs. current (100mhz & 1ghz) ma4sps422 rs (ohms)
4 surmount tm pin diodes ma4sps421, ma4sps422 rev. v7 ma4sps42x series ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. typical performance @ t a = +25c ct vs frequency (@ 0, 5 & 40v) ma4sps421 0.0e+00 5.0e-14 1.0e-13 1.5e-13 2.0e-13 2.5e-13 3.0e-13 0.0e+00 5.0e+08 1.0e+09 1.5e+09 2.0e+09 frequency (hz) ct (f) 0v 40v ct vs frequency (@ 0, 5 & 40v) ma4sps422 0.0e+00 5.0e-14 1.0e-13 1.5e-13 2.0e-13 2.5e-13 3.0e-13 0.0e+00 5.0e+08 1.0e+09 1.5e+09 2.0e+09 frequency (hz) ct (f) 0v 40v ls vs frequency (@ 10ma & 100ma) ma4sps421 0.00e+00 5.00e-11 1.00e-10 1.50e-10 2.00e-10 2.50e-10 3.00e-10 0.0e+00 5.0e+08 1.0e+09 1.5e+09 2.0e+09 frequency (hz) ls (h) 100ma 10ma ls vs frequency (@ 10ma & 100ma) ma4sps422 0.00e+00 5.00e-11 1.00e-10 1.50e-10 2.00e-10 2.50e-10 3.00e-10 0.0e+00 5.0e+08 1.0e+09 1.5e+09 2.0e+09 frequency (hz) ls (h) 100ma 10ma 0 1 2 3 4 5 6 7 8 0.00e+00 2.00e+08 4.00e+08 6.00e+08 8.00e+08 1.00e+09 10ma 100ma frequency (hz) rs (ohms) rs vs. frequency (@10ma & 100ma) ma4sps422 rs vs. frequency (@10ma&100ma) ma 4sps4 21 0 2 4 6 8 10 1.00e+06 2.51e+08 5.01e+08 7.50e+08 1.00e+09 frequency(hz) rs(ohms) 10ma 100ma 5v 5v
5 surmount tm pin diodes ma4sps421, ma4sps422 rev. v7 ma4sps42x series ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ma4sps421 ads spice model pindiodemodel nlpinm1 ffe=1.0 af=1.0 kf=0.0 imax=3.1 e+8 a/m^2 fc=0.5 m=0.5 vj=0.7v cj0=0.07pf rs=0.1 ? tau= 5 s cmin=0.06pf rr=11k ? wi=100 m un=900cm^2/v-sec vi=0.0v is=3.5e-12a wpmax=1.6w wbv=260v ma4sps421 schematic diagram notes rs = 2 * rvia + rp rp cp ls rvia rvia +
6 surmount tm pin diodes ma4sps421, ma4sps422 rev. v7 ma4sps42x series ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. ma4sps422 ads spice pindiodemodel nlpinm1 ffe=1.0 a f=1.0 kf=0.0 imax=7.8e+7 a/m^2 fc=0.5 m=0.5 vj=0.7v cj0=0.13pf rs=0.1 ? tau= 10 s cmin=0.12pf rr=9 k ? wi=100 m un=900cm^2/v-sec vi=0.0v is=3.5e-12a wpmax=1.8w wbv=340v ma4sps422 schematic diagram notes : rs = 2 * rvia + rp rp cp ls ri + r via r via
7 surmount tm pin diodes ma4sps421, ma4sps422 rev. v7 ma4sps42x series ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. handling all semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. the use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. bulk handling should insure that abrasion and mechanical shock are minimized. bonding attachment to a circuit board is made simple through the use of surface mount technology. mounting pads are conveniently located on the bottom surf ace of these devices and are removed from the active junction locations. these devices are well suited for solder attachment onto hard and soft substrates. the use of 80/20, au/sn, 60/40, sn/pb or rohs compliant solders is recommended. conductive silver epoxy solder may also be used but could result in an increase in series and thermal resistance. when soldering these devices to a hard substrate, hot gas die bonding is preferred. we recommend utilizing a vacuum tip and force of 60 to 100 grams applied normal to the top surface of the device. when soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. position the die so that its mounting pads are aligned with the circuit board mo unting pads and reflow the solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. the solder joint must not be made one at a time, creat ing unequal heat flow and thermal stress. solder reflow should not be performed by causing heat to flow throug h the top surface of the die. since the hmic glass is transparent, the edges of the mounting pads closest to eac h other can be visually inspected through the die after attach is completed. recommended temperature and re-flow profiles for 60/40, sn/pb and rohs compliant solders are provided in application note m538 , ?surface mounting instructions?. application note m541 ?bonding and handling procedures for chip diode devices? provides handling and assembly recommendations. ordering information the ma4sps42x series of surmounts may be ordered in either gel packs or tape and reeled by adding the appropriate suffix per the table below. tape and reel dimensions are provided in application note m513 located on the m/a-com tech website @ www.macomtech.com . part number gel pack tape and reel pocket tape ma4sps421 madp-000421-12940p ma4sps422 madp-000422-12950p
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